Research on Delamination Failure of Plastic Ic Packages in Components Reuse Processes
نویسندگان
چکیده
This paper describes the technological process for waste IC components reuse and studies its effect on the reliability of plastic IC components through some experiments. Results show that the high temperature thermal shock during printed circuit board (PCB) disassembly and appearance repair could lead to interfacial delamination and subsequent popcorn cracking in plastic IC packages. In the end of the paper, the generation mechanism and preventive measures are discussed, and a concrete technological process with PCB-baking for plastic IC components reuse, is proposed.
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